Trellisign Microelectronics Solutions
Comprehensive Microelectronics Solutions
VLSI
As VLSI designs grow in complexity with billions of transistors, advanced power constraints, and multi-million gate logic, traditional simulation methods struggle with:
- Long Simulation Times
- Debugging Challenges
- Multi-Language Complexity
- Scalability Issues
Solution Summary
VLSI circuit simulation is a crucial step in semiconductor design that validates functionality, timing, and power behavior before fabrication. VLSI provides high-performance simulation solutions, such as Logic Simulator, which offer fast, scalable, and accurate verification for RTL-to-gate-level designs. These tools ensure early bug detection, reducing costly iterations and accelerating time-to-market.
- Long Simulation Times: Increasing design size leads to slow verification cycles
- Debugging Challenges: Identifying and fixing functional, timing, and power issues is difficult
- Multi-Language Complexity: Designs often combine Verilog, VHDL, and System Verilog, requiring mixed-language support
- Scalability Issues: Large-scale designs demand multi-core acceleration and low-power simulation techniques
Benefits
- Faster Design Verification: Logic Simulator offers multi-core acceleration and optimized simulation algorithms for rapid results.
- Improved Debugging & Coverage: Unified debug and coverage analysis simplifies issue identification and resolution.
- Comprehensive Language Support: Enables Verilog, VHDL, System Verilog, and mixed-language environments for flexible design verification.
- Seamless Integration: Works natively with EDA tool design flow, streamlining the transition from verification to physical design.
- Scalability for Large Designs: Supports low-power simulations, formal verification, and advanced constraints modelling.
Our Approach
How it Works
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Design Entry & Compilation
- The RTL code (Verilog, VHDL, System Verilog) is written and compiled for simulation.
- Mixed-language support allows seamless integration of different hardware description languages.
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Testbench Development
- Functional verification uses directed tests or UVM-based testbenches.
- Simulation stimulus is applied to validate circuit behavior.
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Functional & Timing Simulation
- RTL Simulation: Ensures correct functionality at an abstract level.
- Gate-Level Simulation: Validates timing, power, and logical behavior post-synthesis.
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Debugging & Coverage Analysis
- Waveform viewers, assertion checkers, and debugging tools help identify issues.
- Code coverage, functional coverage, and assertion coverage ensure full verification.
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Performance Optimization & Power Analysis
- Low-power simulation evaluates power consumption under different operating conditions.
- Multi-core and parallel simulation techniques enhance efficiency.
Key Features
High-Performance Simulation
Logic Simulator offers fast and efficient RTL and gate-level simulation.
Comprehensive Language Support
Supports Verilog, System Verilog, VHDL, and mixed-language environments.
Unified Debug & Coverage
Advanced waveform analysis, assertions, and functional coverage support.
Seamless EDA Integration
Works natively with EDA tools for complete design flow.
Technical Specifications
- Simulation Engine: Event-driven and cycle-based simulation for functional and gate-level verification & Multi-core support for faster execution
- Supported Verification Methodologies: UVM (Universal Verification Methodology), System Verilog Assertions (SVA), Code and Functional Coverage Analysis
- Supported Languages: Verilog, System Verilog, VHDL, PSL (Property Specification Language)
- System Requirements:
OS: Linux (RHEL/CentOS), Windows
RAM: 16GB (Recommended: 32GB+)
CPU: Multi-core processor (4+ cores for parallel simulation)
Storage: Minimum 20GB free disk space
PCB Design
Advanced Simulation Features
Traditional circuit simulation focuses on verifying basic functionality but does not account for component variations, design optimization, or long-term reliability. Engineers face challenges in:
- Identifying critical components affecting performance
- Finding optimal component values for efficiency
- Analysing circuit behavior under real-world variations
- Ensuring reliability and avoiding component failures
Solution Summary
Advanced Analysis provides powerful simulation techniques for circuit optimization, sensitivity analysis, reliability testing, and parametric exploration. It helps engineers improve circuit robustness, optimize performance, and assess worst-case scenarios under real-world variations
Our Approach
How it Works
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Sensitivity Analysis
- Determines how much each component affects the circuit’s performance.
- Assigns a sensitivity score to components based on their impact on key circuit parameters.
- Helps prioritize critical components for tighter tolerances.
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Optimizer
- Uses algorithms to find the best values for circuit parameters.
- Adjusts component values to meet design specifications (e.g., lowest power, best gain).
- Supports different optimization goals: Minimization, Maximization, Target Matching.
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Monte Carlo Analysis
- Simulates circuit performance under component variations (e.g., resistor tolerance, temperature shifts).
- Runs multiple iterations using randomized values within defined tolerances.
- Helps evaluate worst-case and statistical performance.
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Smoke (Stress) Analysis
- Analyzes stress levels on components (power dissipation, current, voltage limits).
- Highlights components at risk of overheating or exceeding safe operating limits.
- Prevents circuit failure due to stress-related damage.
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Parametric Plotter
- Varies one or more parameters to analyze their impact on circuit behavior.
- Generates plots showing the relationship between design parameters and output responses.
- Useful for tuning circuits and exploring design trade-offs.
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Signal Integrity Analysis
- Ensures reliable communication and performance in high-speed designs.
- Provides powerful tools to evaluate and address signal integrity challenges.
- Crosstalk Analysis: Identify and mitigate unwanted coupling between signal traces.
- Reflection and Impedance Matching: Simulate and optimize trace impedance to prevent signal reflections.
- Timing and Noise Analysis: Ensure signals reach their destinations with proper timing and minimal distortion.
IC Packaging
Traditional IC packaging methods face limitations in terms of performance, power consumption, and miniaturization. As semiconductor technology scales, there is a growing need for high-density integration, improved thermal management, and better electrical performance. Conventional packaging solutions struggle to meet these demands, necessitating the adoption of advanced packaging techniques.
Solution Summary
Traditional IC packaging methods face limitations in terms of performance, power consumption, and miniaturization. As semiconductor technology scales, there is a growing need for high-density integration, improved thermal management, and better electrical performance. Conventional packaging solutions struggle to meet these demands, necessitating the adoption of advanced packaging techniques.
Benefits
- Improved Performance: Reduced interconnect delays and enhanced signal integrity.
- Power Efficiency: Lower power consumption due to shorter interconnects.
- Higher Integration Density: Enables stacking and heterogeneous integration.
- Enhanced Reliability: Better thermal and mechanical management.
- Faster Time-to-Market: Streamlined design and validation processes using advanced tools.
Our Approach
How it Works
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Wire Bonding
- Traditional method using wires to connect die to package.
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Flip-Chip (C4)
- Direct bump connections for improved electrical performance.
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2.5D IC Packaging
- Uses silicon interposers for connecting multiple dies.
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3D IC Packaging
- Stacks dies vertically with through-silicon vias (TSVs).
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Fan-Out Wafer-Level Packaging (FOWLP)
- Eliminates substrate for compact and efficient designs.
Key Features of Integrated Design Environment
Integrated Design Environment
Seamless integration of IC, package, and PCB design.
Multi-Physics Analysis
Thermal, electrical, and mechanical simulations.
Design Rule Checking (DRC)
Ensures manufacturability and compliance.
Chiplet Integration Support
Enables heterogeneous system designs.
Technical Specifications
- Supported Technologies: 2.5D, 3D IC, FOWLP, flip-chip, wire bonding
- Design Tools: Cadence Allegro, SiP Layout, Clarity 3D Solver, Sigrity
- Simulation Capabilities: Thermal, power integrity, and signal integrity analysis
- Interoperability: Supports standard file formats like ODB++, LEF/DEF, GDSII
Industry Solutions
- Consumer Electronics: 2.5D, 3D IC, FOWLP, flip-chip, wire bonding
- Design Tools: Cadence Allegro, SiP Layout, Clarity 3D Solver, Sigrity
- Simulation Capabilities: Thermal, power integrity, and signal integrity analysis
- Interoperability: Supports standard file formats like ODB++, LEF/DEF, GDSII
IC Design
Our Offerings
Trellisign offers various bundles to enhance design capabilities in VLSI chip design, catering to different segments such as research, standard, and packaging. These bundles include comprehensive toolsets for Digital Physical Design, Simulation, and Timing Analysis, enabling users to leverage industry-leading design methodologies and IP.
Our portfolio offers resources over the entire spectrum of VLSI Chip Design Life Cycle to the academia, covering the following:
- Custom Digital IC Design and Verification
- Custom Analog/ Mixed Signal Design and Verification
- Digital ASIC Design and Verification
- Fabrication and Post Silicon Testing
Solutions Offered
Cadence University Bundle: Empowering academia and research institutions, Cadence University Bundle provides cutting-edge tools for exploring advanced semiconductor designs and systems. Tailored for innovative projects, this bundle supports state-of-the-art simulation, verification, and layout solutions to foster breakthroughs in electronic design automation.
Packaging Bundle: The Packaging Bundle enables streamlined chip-package-board co-design with integrated tools for IC packaging, thermal analysis, and signal/power integrity. It addresses the growing complexity of modern electronics, ensuring optimized designs and faster time to market.
Support Forum
Application Engineers at Trellisign play a critical role in helping customers successfully implement and optimize Cadence’s EDA tools and solutions. They provide technical expertise, support, and training to ensure seamless integration into design workflows. They bridge the gap between customer needs and product development.
Key Features
Working with customers to understand design challenges
Collaborating closely with customers to identify and address their design challenges.
Developing solutions using Cadence’s software
Creating custom solutions and designs using Cadence’s cutting-edge software tools.
Offering post-sales support and troubleshooting
Providing ongoing support and resolving any issues that arise after the sale of tools.
Providing feedback to R&D for tool enhancement
Gathering customer feedback to provide valuable insights for product improvement.
Installation Support
Installation Support for EDA Tools ensures seamless deployment of electronic design automation (EDA) software by assisting users with the setup, configuration, and troubleshooting of the tools.
Key Functions
System Compatibility Checks
Verifying that customer hardware and operating systems meet tool requirements.
License Installation
Assisting in configuring FlexNet license servers and managing license files.
Tool Installation
Guiding users through the step-by-step installation process for EDA tool products.
Environment Setup
Configuring shell environments (.bashrc, .cshrc) for proper tool execution.
Error Resolution
Troubleshooting issues such as missing dependencies, path errors, or license-related problems.
Software Updates
Supporting the installation of patches and new tool releases to ensure performance and feature enhancements.
Documentation and Training
Providing manuals, FAQs, and training for self-installation and configuration.
University Tech Bytes (UTB): Learn, Explore, Innovate
UTB is a curated series of lab-based experiments sourced from leading universities across India. Designed to bridge the gap between theoretical knowledge and real-world applications, UTB enhances learning through hands-on training, visual demonstrations, and expert-led sessions.
Whether you're a student, educator, or industry professional, UTB equips you with practical skills and domain expertise essential for tackling real-world challenges.
Key Functions
Learning
UTB sessions provide practical experience with industry-standard tools which enables students to apply theoretical concepts in real-world scenarios.
Expert Mentorship
Guidance from mentors helps students navigate complex design & analysis tasks, fostering a deeper understanding of the subject matter.
Comprehensive Coverage
The program covers a wide range of topics, from ASIC design and verification to diverse engineering disciplines.
Accessible Resources
Recorded sessions and supplementary materials are available for students to review and reinforce their learning at their own pace.
